SP900S-0.009-00-105 PDF Datablad Download - THERM PAD 36.83MMX21.29MM PINK

Varenummer : SP900S-0.009-00-105

Fabrikant : Bergquist

Beskrivelse : THERM PAD 36.83MMX21.29MM PINK

Serie : Sil-Pad® 900-S

Del Status : Active

Anvendelse : SIP

Type : Pad, Sheet

Form : Rectangular

Omrids : 36.83mm x 21.29mm

Tykkelse : 0.0090" (0.229mm)

Materiale : Silicone Rubber

Lim : -

Backing, Carrier : Fiberglass

Farve : Pink

Termisk modstandsdygtighed : 0.61°C/W

Varmeledningsevne : 1.6 W/m-K

Vægt : -

Tilstand : Nye og originale

Kvalitet Garanti : 365 dage garanti

Stock Resource : Franchise Distributør / Producent Direct

Oprindelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Producentens varenummer

Intern Part Number

Fabrikant

Kort beskrivelse

THERM PAD 36.83MMX21.29MM PINK

RoHS status

Bly fri / RoHS

Leveringstid

1-2 dage

disponible mængde

687655 Stykker

henvisning Pris

~~USD 0~~

Vores pris

- (Venligst kontakt os for en bedre pris: [email protected])

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EPM7256AEQC208-10N	Intel	IC CPLD 256MC 10NS 208QFP
XCR3384XL-12TQG144I	Xilinx Inc.	IC CPLD 384MC 10.8NS 144QFP
XCR3512XL-12FG324C	Xilinx Inc.	IC CPLD 512MC 10.8NS 324BGA
M5-512/256-7SAC	Lattice Semiconductor Corporation	IC CPLD 512MC 7.5NS 352SBGA
XC2C384-7FTG256C	Xilinx Inc.	IC CPLD 384MC 7.1NS 256BGA
EPM7512AEFC256-12N	Intel	IC CPLD 512MC 12NS 256FBGA
XCR3512XL-12FTG256C	Xilinx Inc.	IC CPLD 512MC 10.8NS 256BGA
XC2C512-10PQG208C	Xilinx Inc.	IC CPLD 512MC 9.2NS 208QFP
XCR3384XL-12PQ208I	Xilinx Inc.	IC CPLD 384MC 10.8NS 208QFP
EPM7512AEQI208-10	Intel	IC CPLD 512MC 10NS 208QFP

SP900S-0.009-00-105 Blad