SP900S-0.009-AC-1212 PDF Datablad Download - THERM PAD 304.8MMX304.8MM W/ADH

Varenummer : SP900S-0.009-AC-1212

Fabrikant : Bergquist

Beskrivelse : THERM PAD 304.8MMX304.8MM W/ADH

Serie : Sil-Pad® 900-S

Del Status : Active

Anvendelse : -

Type : Pad, Sheet

Form : Square

Omrids : 304.80mm x 304.80mm

Tykkelse : 0.0090" (0.229mm)

Materiale : Silicone Rubber

Lim : Adhesive - One Side

Backing, Carrier : Fiberglass

Farve : Pink

Termisk modstandsdygtighed : 0.61°C/W

Varmeledningsevne : 1.6 W/m-K

Vægt : -

Tilstand : Nye og originale

Kvalitet Garanti : 365 dage garanti

Stock Resource : Franchise Distributør / Producent Direct

Oprindelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Producentens varenummer

Intern Part Number

Fabrikant

Kort beskrivelse

THERM PAD 304.8MMX304.8MM W/ADH

RoHS status

Bly fri / RoHS

Leveringstid

1-2 dage

disponible mængde

17592 Stykker

henvisning Pris

~~USD 0~~

Vores pris

- (Venligst kontakt os for en bedre pris: [email protected])

AX Semiconductor har SP900S-0.009-AC-1212 på lager til sælge.

Shipping muligheder og forsendelse tid:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betalingsmuligheder:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Varenummer	Brand	Beskrivelse
XC2C512-7FT256C	Xilinx Inc.	IC CPLD 512MC 7.1NS 256BGA
M4A5-256/128-7YNC	Lattice Semiconductor Corporation	IC CPLD 256MC 7.5NS 208QFP
XCR3384XL-10FTG256I	Xilinx Inc.	IC CPLD 384MC 9NS 256BGA
EPM7512AEFC256-10N	Intel	IC CPLD 512MC 10NS 256FBGA
XCR3512XL-7PQ208C	Xilinx Inc.	IC CPLD 512MC 7NSNS 208QFP
EPM7256AEQC208-7N	Intel	IC CPLD 256MC 7.5NS 208QFP
XCR3384XL-10TQG144C	Xilinx Inc.	IC CPLD 384MC 9NS 144QFP
EPM7128AEFC100-5N	Intel	IC CPLD 128MC 5NS 100FBGA
EPM7512AEQC208-12N	Intel	IC CPLD 512MC 12NS 208QFP
XC2C384-7FGG324C	Xilinx Inc.	IC CPLD 384MC 7.1NS 324FBGA

SP900S-0.009-AC-1212 Blad