BDN16-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.61SQ

Producentens varenummer

BDN16-3CB/A01

Intern Part Number

AX-BDN16-3CB/A01

Fabrikant

CTS Thermal Management Products

Kort beskrivelse

HEATSINK CPU W/ADHESIVE 1.61SQ

RoHS status

Bly fri / RoHS

Leveringstid

1-2 dage

disponible mængde

95620 Pieces

henvisning Pris

~~USD 2.934~~

Vores pris

- (Venligst kontakt os for en bedre pris: [email protected])

AX Semiconductor har BDN16-3CB/A01 på lager til sælge.

Shipping muligheder og forsendelse tid:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betalingsmuligheder:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Specifikationer for BDN16-3CB/A01

Kvalitet Garanti : 365 dage garanti

Stock Resource : Franchise Distributør / Producent Direct

Oprindelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Varenummer : BDN16-3CB/A01

Fabrikant : CTS Thermal Management Products

Beskrivelse : HEATSINK CPU W/ADHESIVE 1.61SQ

Serie : BDN

Del Status : Active

Type : Top Mount

Pakke afkølet : Assorted (BGA, LGA, CPU, ASIC...)

Vedhæftningsmetode : Thermal Tape, Adhesive (Included)

Form : Square, Pin Fins

Længde : 1.610" (40.89mm)

Bredde : 1.610" (40.89mm)

Diameter : -

Højde Off Base (Højde af Fin) : 0.355" (9.02mm)

Effektdissipation @ Temperaturstigning : -

Termisk modstand @ Forceret luftstrøm : 4.50°C/W @ 400 LFM

Termisk modstand @ Naturligt : 13.50°C/W

Materiale : Aluminum

Materiale finish : Black Anodized

Vægt : -

Tilstand : Nye og originale

relaterede links : BDN1 , BDN16-

Dokumenter til BDN16-3CB/A01

Dataark : BDN16-3CB/A01.pdf

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