DILB16P-223TLF - CONN IC DIP SOCKET 16POS TIN
Producentens varenummer
Intern Part Number
Fabrikant
Kort beskrivelse
CONN IC DIP SOCKET 16POS TIN
RoHS status
Bly fri / RoHS
Leveringstid
1-2 dage
disponible mængde
1558680 Pieces
henvisning Pris
Vores pris
- (Venligst kontakt os for en bedre pris: [email protected])
- AX Semiconductor har DILB16P-223TLF på lager til sælge.
- Shipping muligheder og forsendelse tid:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Betalingsmuligheder:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Specifikationer for DILB16P-223TLF
Kvalitet Garanti :
365 dage garanti
Stock Resource :
Franchise Distributør / Producent Direct
Oprindelsesland :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Varenummer :
DILB16P-223TLF
Fabrikant :
Amphenol ICC (FCI)
Beskrivelse :
CONN IC DIP SOCKET 16POS TIN
Serie :
-
Del Status :
Active
Type :
DIP, 0.3" (7.62mm) Row Spacing
Antal positioner eller stifter (gitter) :
16 (2 x 8)
Pitch - Parring :
0.100" (2.54mm)
Kontakt Afslut - Parring :
Tin
Kontakt Afslut tykkelse - Parring :
100.0µin (2.54µm)
Kontaktmateriale - Parring :
Copper Alloy
Monteringstype :
Through Hole
Funktioner :
Open Frame
Afslutning :
Solder
Pitch - Post :
0.100" (2.54mm)
Kontakt Afslut - Post :
Tin
Kontakt Afslut tykkelse - Post :
100.0µin (2.54µm)
Kontaktmateriale - Post :
Copper Alloy
Boligmateriale :
Polyamide (PA), Nylon
Driftstemperatur :
-55°C ~ 105°C
Vægt :
-
Tilstand :
Nye og originale
Dokumenter til DILB16P-223TLF
Dataark :
DILB16P-223TLF.pdf
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