BGM15LBA12E6327XTSA1 - MULTI CHIP MODULES

Producentens varenummer

BGM15LBA12E6327XTSA1

Intern Part Number

AX-BGM15LBA12E6327XTSA1

Fabrikant

Infineon Technologies

Kort beskrivelse

MULTI CHIP MODULES

RoHS status

Bly fri / RoHS

Leveringstid

1-2 dage

disponible mængde

1052310 Pieces

henvisning Pris

~~USD 0.266616~~

Vores pris

- (Venligst kontakt os for en bedre pris: [email protected])

AX Semiconductor har BGM15LBA12E6327XTSA1 på lager til sælge.

Shipping muligheder og forsendelse tid:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betalingsmuligheder:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Specifikationer for BGM15LBA12E6327XTSA1

Kvalitet Garanti : 365 dage garanti

Stock Resource : Franchise Distributør / Producent Direct

Oprindelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Varenummer : BGM15LBA12E6327XTSA1

Fabrikant : Infineon Technologies

Beskrivelse : MULTI CHIP MODULES

Serie : -

Del Status : Active

RF familie / standard : Bluetooth

protokol : 802.11a/b/g/n, Bluetooth v4.0

Modulation : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM

Frekvens : 703MHz ~ 960MHz

Datahastighed : 54Mbps

Power - Output : -4dBm

Følsomhed : -

Serielle grænseflader : SPI, USB

Antenne Type : -

Udnyttet IC / Del : -

Hukommelsesstørrelse : -

Spænding - Supply : 1.7V ~ 3.1V

Nuværende - Modtagelse : -

Nuværende - Sende : -

Monteringstype : Surface Mount

Driftstemperatur : -40°C ~ 85°C

Pakke / tilfælde : 12-UFQFN Exposed Pad

Vægt : -

Tilstand : Nye og originale

relaterede links : BGM15L , BGM15LBA12

Dokumenter til BGM15LBA12E6327XTSA1

Dataark : BGM15LBA12E6327XTSA1.pdf

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