BDN12-5CB/A01 - HEATSINK CPU W/ADHESIVE 1.21SQ

Producentens varenummer
Intern Part Number
Kort beskrivelse
HEATSINK CPU W/ADHESIVE 1.21SQ
RoHS status
Bly fri / RoHS
Leveringstid
1-2 dage
disponible mængde
159585 Pieces
henvisning Pris
USD 1.758
Vores pris
- (Venligst kontakt os for en bedre pris: [email protected])

AX Semiconductor har BDN12-5CB/A01 på lager til sælge.
Shipping muligheder og forsendelse tid:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Betalingsmuligheder:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Specifikationer for BDN12-5CB/A01

Kvalitet Garanti : 365 dage garanti
Stock Resource : Franchise Distributør / Producent Direct
Oprindelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Varenummer : BDN12-5CB/A01
Fabrikant : CTS Thermal Management Products
Beskrivelse : HEATSINK CPU W/ADHESIVE 1.21SQ
Serie : BDN
Del Status : Active
Type : Top Mount
Pakke afkølet : Assorted (BGA, LGA, CPU, ASIC...)
Vedhæftningsmetode : Thermal Tape, Adhesive (Included)
Form : Square, Pin Fins
Længde : 1.210" (30.73mm)
Bredde : 1.210" (30.73mm)
Diameter : -
Højde Off Base (Højde af Fin) : 0.555" (14.10mm)
Effektdissipation @ Temperaturstigning : -
Termisk modstand @ Forceret luftstrøm : 5.20°C/W @ 400 LFM
Termisk modstand @ Naturligt : 16.50°C/W
Materiale : Aluminum
Materiale finish : Black Anodized
Vægt : -
Tilstand : Nye og originale
relaterede links : BDN1 , BDN12-

Dokumenter til BDN12-5CB/A01

Dataark : BDN12-5CB/A01.pdf

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